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Job Summary:
- Seeking a highly motivated Packaging Process Engineer for SiTime in Singapore, focusing on Bumping, Flip-chip, and WLCSP technologies.
- Responsible for developing, optimizing, and sustaining advanced packaging processes to ensure high-quality and high-yield manufacturing.
Responsibilities:
- Develop, optimize, and characterize packaging processes for WLCSP including bumping, RDL, underfill, and dicing.
- Perform root cause analysis and implement corrective and preventive actions using 8D methodology.
- Conduct process capability analysis, implement SPC, and drive continuous improvement initiatives.
Desired Characteristics and Attributes:
- Core skills in process efficiency, material knowledge, and quality standards like GMP.
- Personal traits include problem-solving, attention to detail, and strong communication skills.
SiTime
SiTime is the Precision Timing company, providing MEMS-based programmable timing solutions for electronics. With over 4 billion devices shipped, they offer a dynamic and innovative environment for engineers.