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Role Overview:
- Own one program embedded with the engineering team from packaging to system bring-up.
- Drive schedule, risks, and handoffs while staying close to technical details.
Ideal Background:
- 8+ years in semiconductor or hardware development with programs taken from development to working hardware.
- Deep working knowledge of advanced packaging and assembly, or ASIC/SoC and system hardware.
Collaboration:
- Communicate clearly and directly with engineers, partners, and leadership.
- Run work with external foundries, OSATs, and IP or design-services vendors.
Nice to Have:
- Experience with advanced node tape-outs, photonic assemblies, or chiplet programs.
- Familiarity with reliability qualification, failure analysis, test vehicles, and DOEs.
Unknown
We are a semiconductor company developing wafer-scale photonic systems for optical I/O and high-performance computing. We are an engineering-driven team with a hands-on, action-oriented culture that values technical depth and direct communication.