Lead advanced ASIC package architecture and execution, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions.
Own the end-to-end package strategy for high-performance mixed-signal and digital SoCs from early architecture and trade studies through vendor engagement, qualification, and production ramp.
Operate as the technical authority for package design, defining standards, influencing silicon and system architecture, and ensuring first-pass success for complex, high-speed, power-dense ASICs.
Lead SoC architecture by translating Product Requirements Documents (PRDs) into SoC-level architectures in collaboration with subsystem architects and cross-functional teams
Define SoC architecture including memory, systems, interconnects, clocking, power, IP requirements, and system integration
Own architectural specifications and documentation from definition through productization
MatX designs hardware tailored for the world’s best AI models. They are developing vertically integrated full-stack solutions from silicon to systems including hardware and software to train and run the world's largest models.
Contribute to high-density electrical design for next-generation GPS tracking devices.
Perform DFMEA, PFMEA, stress analysis, and tolerance analysis to ensure design robustness.
Design and build programming jigs, test fixtures, dev boards, and interface helper boards.
Life360’s mission is to keep people close to the ones they love through their mobile app, Tile tracking devices, and Pet GPS tracker. The company has more than 500 remote-first employees and continues to grow.
Design and optimize passive and active PIC building blocks.
Contribute to subsystem- and chip-level design decisions.
Analyze electro-optic and optical measurement data, support debug, and drive model updates and design improvements.
Client is building advanced silicon photonics and heterogeneous photonics technologies for next-generation compute, connectivity, and sensing platforms. This is a high-ownership startup role for someone who wants to move fast under uncertainty, solve hard cross-functional problems, and help build a path from first silicon to advanced high-volume products.
Own end-to-end fiber and network infrastructure deployment across colo data center sites.
Design fiber pathways, structured cabling systems, and high-density fiber distribution architectures.
Oversee installation of fiber (SMF/MMF), patch panels, trays, and cable management systems.
Cerebras Systems builds the world's largest AI chip, 56 times larger than GPUs. Our novel wafer-scale architecture provides the AI compute power of dozens of GPUs on a single chip, with the programming simplicity of a single device. We celebrate different backgrounds, perspectives, and skills.
Represent the company in global standards organizations.
Columbia General is dedicated to creating innovative, high-speed data communication technologies. They foster relationships with key stakeholders and enhance leadership in a rapidly evolving, connected world.