Similar Jobs
See allSOC Architect (Remote)
MatX
US
Bash
C/C++
Python
Senior II Hardware Engineer (EE)
Life360
US
Silicon Photonics Integrated Circuit Design Engineer / Tech Lead
Client
US
Layout
Network Fiber Engineer
Cerebras Systems
US
Troubleshooting
Communication
R&D/Product Developer
Columbia General
Global
Engineering
Analysis
Communication
Responsibilities:
- Own ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraints.
- Lead package-level trade studies across cost, performance, power integrity (PI), signal integrity (SI), thermal, manufacturability, and reliability.
- Define long-term packaging roadmap aligned with future ASIC nodes, bandwidth scaling, and multi-die integration.
Qualifications:
- Bachelor’s degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field.
- 10+ years of experience in ASIC package design, with deep expertise in FC-BGA.
- Proven experience delivering high-pin-count, high-performance ASIC packages into production.
Nice to Have:
- Experience with MCM or heterogeneous integration (chiplets, interposers, advanced laminates).
- Background in high-speed digital or mixed-signal SoCs.
- Familiarity with aerospace, space, or high-reliability electronics.
K2 Space
K2 is building the largest and highest-power satellites ever flown, unlocking performance levels previously out of reach across every orbit. Backed by $450M from leading investors, we’re mass-producing the highest-power satellite platforms ever built for missions from LEO to deep space.