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Responsibilities:
- Own ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraints.
- Lead package-level trade studies across cost, performance, power integrity (PI), signal integrity (SI), thermal, manufacturability, and reliability.
- Define long-term packaging roadmap aligned with future ASIC nodes, bandwidth scaling, and multi-die integration.
Requirements:
- Bachelor’s degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field.
- 10+ years of experience in ASIC package design, with deep expertise in FC-BGA.
- Proven experience delivering high-pin-count, high-performance ASIC packages into production.
Preferred Skills:
- Experience with MCM or heterogeneous integration (chiplets, interposers, advanced laminates).
- Background in high-speed digital or mixed-signal SoCs.
- Familiarity with aerospace, space, or high-reliability electronics.
K2 Space
K2 is building the largest and highest-power satellites ever flown, backed by over $1 billion in funding and contracts. They are mass-producing satellites for LEO to deep space, with plans to scale to 100 satellites a year.