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Who You Are:
- A seasoned ASIC Physical Design Engineer with 5+ years at advanced nodes.
- Strong in full-chip implementation, comfortable owning blocks from RTL to GDSII.
- Detail-oriented and methodical with STA, constraints, and closure for complex, high-speed designs.
What We Need:
- Lead Die-to-Die (D2D) physical implementation and closure.
- Own the full PD flow (RTL-to-GDSII): synthesis, floorplanning, P&R, CTS, optimization, and sign-off.
- Improve and maintain physical design methodologies, flows, and automation scripts (Tcl, Python).
What You’ll Learn:
- How to implement and close cutting-edge D2D interfaces in advanced multi-die/chiplet architectures.
- Advanced strategies for co-optimizing routing, power grid, and timing for high-speed links across dies.
- Deeper integration techniques working with analog PHY teams.
Tenstorrent
Tenstorrent is driving high-performance AI technology, aiming for superior performance, ease of use, and cost efficiency. Their diverse team is dedicated to creating the best possible AI platform and values collaboration, curiosity, and a passion for hard problems.