Provide technical guidance to customer PCB design and manufacturing teams throughout the product lifecycle, advising on routing, signal integrity, stack-up, and materials.
Educate customers on DFM and DFV principles to improve product quality, reliability, and manufacturability while reducing design-cycle time.
Facilitate communication between customers, sales, and manufacturing operations to align technical requirements and support transitions from prototype to high-volume production.
This partner company provides PCB design and manufacturing engineering support services to customers across North America and Asia-Pacific. The company values technical expertise, cross-functional collaboration, and a remote-first culture, with a focus on quality and customer outcomes.
Collaborate with engineering, project management, test, and operations teams in small, multidisciplinary teams to meet demanding, schedule-driven customer requirements.
Lead the design and development of 3U and 6U VPX single board computers, FPGA, switch, and I/O cards supporting high data rates.
Support business development, program managers, and customer teams in translating requirements into practical system and functional designs.
Curtiss-Wright's Defense Solutions division is a trusted, proven leader delivering superior products and services for defense and aerospace applications. The company is a global diversified industrial organization with over 95 years of growth, focusing on advanced technologies for high-performance platforms.
Define and implement end-to-end DFT architecture for complex SoCs, including Hierarchical DFT, Scan compression, Boundary Scan, and MBIST.
Develop strategies for In-System Test (IST) and power-on self-test (POST) to ensure chip health in remote edge data centers.
Oversee scan insertion, ATPG (Stuck-at, Transition, Path Delay), and Memory/Logic BIST, collaborating with cross-functional teams.
EnCharge AI is a leader in advanced AI hardware and software systems for edge-to-cloud computing. The company launched in 2022 and is led by veteran technologists with backgrounds in semiconductor design and AI systems.
Own the overall EPIC SoC architecture from concept to production, translating MRD into a complete PRD covering digital, analog, I/O, and memory subsystems.
Drive the digital and high-speed I/O subsystem architecture, with deep expertise in high-speed SerDes and protocol logic for UCIe, PCIe, and Ethernet.
Integrate subsystem architectures from analog, photonics, packaging, and memory teams into a coherent full-chip architecture, ensuring internal consistency and feasibility.
Black Semiconductor develops graphene-based photonic technology to create high-throughput, low-delay computing networks for the semiconductor industry. They are a growing company with a human-centered culture emphasizing collaboration, innovation, and openness.
Define and lead scalable verification strategies for PCIe, CXL, Ethernet, and UCIe subsystems.
Architect reusable UVM environments, testbenches, and verification components for high-speed protocols.
Drive coverage closure, debug across simulation and silicon, and mentor verification engineers.
They develop next-generation semiconductor infrastructure for AI and HPC, specializing in high-speed interconnect IP and SoC verification. The team is fast-paced, globally distributed, and collaborative with minimal bureaucracy.
Lead end-to-end architecture design of AI Data Center Networks, high-performance DCI, and global backbone networks for large-scale GPU clusters.
Collaborate with NVIDIA, vendors, and partners to translate business requirements into top-level network designs including InfiniBand/RoCE, Spine-Leaf, and overlay integration.
Own congestion control tuning, produce architecture documentation, and identify risks to drive network evolution.
Bitdeer is a world-leading technology company for AI and Bitcoin mining infrastructure. Headquartered in Singapore, the company operates data centers across multiple countries and is building AI computational infrastructure.