Senior ASIC Package Design Engineer

Responsibilities:

• Define ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraints.
• Lead package-level trade studies across cost, performance, power integrity (PI), signal integrity (SI), thermal, manufacturability, and reliability.
• Establish package design standards, methodologies, and best practices.

Qualifications:

• Bachelor’s degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field.
• 5+ years of experience in ASIC package design, with deep expertise in FC-BGA.
• Proven experience delivering high-pin-count, high-performance ASIC packages into production.

Nice to Have:

• Experience with MCM or heterogeneous integration (chiplets, interposers, advanced laminates).
• Background in high-speed digital or mixed-signal SoCs.
• Familiarity with aerospace, space, or high-reliability electronics.