Lead advanced ASIC package architecture and execution, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions.
Own the end-to-end package strategy for high-performance mixed-signal and digital SoCs from early architecture and trade studies through vendor engagement, qualification, and production ramp.
Operate as the technical authority for package design, defining standards, influencing silicon and system architecture, and ensuring first-pass success for complex, high-speed, power-dense ASICs.
K2 is building the largest and highest-power satellites ever flown, unlocking performance levels previously out of reach across every orbit. Backed by $450M from leading investors, we’re mass-producing the highest-power satellite platforms ever built for missions from LEO to deep space.
Develop the timing constraints and validate them—from RTL handoff to synthesis.
Drive timing closure across multiple voltage and process corners, including sign-off with foundry-qualified tools.
Develop and maintain design methodologies, scripts, and automation to optimize performance, power, and area (PPA).
K2 is building the largest and highest-power satellites ever flown, unlocking performance levels previously out of reach across every orbit. Backed by $450M from leading investors, we’re mass-producing the highest-power satellite platforms ever built for missions from LEO to deep space.