Lead advanced ASIC package architecture and execution, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions.
Own the end-to-end package strategy for high-performance mixed-signal and digital SoCs from early architecture and trade studies through vendor engagement, qualification, and production ramp.
Operate as the technical authority for package design, defining standards, influencing silicon and system architecture, and ensuring first-pass success for complex, high-speed, power-dense ASICs.
K2 is building the largest and highest-power satellites ever flown, unlocking performance levels previously out of reach across every orbit. Backed by $450M from leading investors, we’re mass-producing the highest-power satellite platforms ever built for missions from LEO to deep space.
Define ASIC package architecture for FC-BGA and MCM solutions.
Lead package-level trade studies across cost, performance, power integrity (PI), signal integrity (SI), thermal, manufacturability, and reliability.
Establish package design standards, methodologies, and best practices.
K2 is building the largest and highest-power satellites ever flown, unlocking performance levels previously out of reach across every orbit. Backed by $450M from leading investors, they're mass-producing the highest-power satellite platforms ever built for missions from LEO to deep space.
Lead SoC architecture by translating Product Requirements Documents (PRDs) into SoC-level architectures in collaboration with subsystem architects and cross-functional teams
Define SoC architecture including memory, systems, interconnects, clocking, power, IP requirements, and system integration
Own architectural specifications and documentation from definition through productization
MatX designs hardware tailored for the world’s best AI models. They are developing vertically integrated full-stack solutions from silicon to systems including hardware and software to train and run the world's largest models.