Cerebras Systems

4 open remote positions

Cerebras Systems builds the world's largest AI chip, 56 times larger than GPUs. They deliver industry-leading training and inference speeds and empowers machine learning users to effortlessly run large-scale ML applications. They have a simple, non-corporate work culture that respects individual beliefs.

Salary Distribution 4 of 4 jobs

Benefits Overview 4 of 4 jobs

401(k) (4) Disability coverage (4) Life insurance (4) Medical (4) On-site gym (4) PTO (4) Parental leave (4) Wellness programs (4) Holidays (3) Wellbeing benefits (3) Paid holidays (1) Wellbeing (1)

Open Positions

$200,000–$280,000/yr

  • Lead advanced ASIC package architecture and execution, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions.
  • Own the end-to-end package strategy for high-performance mixed-signal and digital SoCs from early architecture and trade studies through vendor engagement, qualification, and production ramp.
  • Operate as the technical authority for package design, defining standards, influencing silicon and system architecture, and ensuring first-pass success for complex, high-speed, power-dense ASICs.

$150,000–$200,000/yr

  • You’ll help establish patterns, ship early AI-driven capabilities, and influence the technical direction of AI across multiple products.
  • This is a full-stack role where you will build and ship AI-powered features across the Momence platform.
  • Collaborate with teams across Momence, Mariana Tek, and other platforms to identify high-impact opportunities for AI.