Cerebras Systems builds the world's largest AI chip, 56 times larger than GPUs. They deliver industry-leading training and inference speeds and empowers machine learning users to effortlessly run large-scale ML applications. They have a simple, non-corporate work culture that respects individual beliefs.
Lead advanced ASIC package architecture and execution, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions.
Own the end-to-end package strategy for high-performance mixed-signal and digital SoCs from early architecture and trade studies through vendor engagement, qualification, and production ramp.
Operate as the technical authority for package design, defining standards, influencing silicon and system architecture, and ensuring first-pass success for complex, high-speed, power-dense ASICs.