$200,000–$280,000/yr
US
- Lead advanced ASIC package architecture and execution, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions.
- Own the end-to-end package strategy for high-performance mixed-signal and digital SoCs from early architecture and trade studies through vendor engagement, qualification, and production ramp.
- Operate as the technical authority for package design, defining standards, influencing silicon and system architecture, and ensuring first-pass success for complex, high-speed, power-dense ASICs.